Senior/Principal RF Test Engineer, Texas Institute for Electronics

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Job Details:

Texas Institute for Electronics (TIE) is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative.

A key part of our mission is to advance the state of the art in 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystems- catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices.

Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, we are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing.

TIE's 3DHI and chiplet integration platforms integrate novel thermal management and advanced interconnect solutions to deliver unprecedented performance and energy efficiency. Operating at the intersection of defense electronics and commercial markets, TIE offers a rare opportunity to reimagine an industry from the ground up and build transformative products with global impact.

Must be eligible to work in the United States on a full-time basis for any employer without sponsorship.

The Senior/Principal RF Engineer will help ensure new technologies are evaluated and ready to move forward by providing reliable performance insights that support decision-making. They will also strengthen the organization's testing capabilities by improving processes, building effective tools, and creating clear guidance for internal teams and partners.

• Develop and execute RF test plans for K-band (18-27 GHz), Ka-band (27-40 GHz), and W-band (75-110 GHz) microsystems at wafer, die, module, and system levels.
• Perform S-parameter characterization, on-wafer probing, noise figure measurements, and power sweeps using vector network analyzers, spectrum analyzers, and signal generators.
• Design and implement automated test sequences using Python, MATLAB, or LabVIEW to drive measurement instruments and collect production-grade data across process corners and temperature.
• Develop de-embedding methodologies and calibration strategies for high-frequency measurements, including TRL, LRRM, and multi-line calibrations for on-wafer and package-level probing.
• Correlate measured RF results against EM simulation models (HFSS, ADS, AWR, CST) to validate design intent and feed deviations back to the design and packaging teams.
• Characterize passive and active RF components-including transmission lines, filters, LNAs, PAs, and T/R modules-within 3.0D heterogeneously integrated assemblies.
• Support test infrastructure buildout, including fixture design, probe card specification, and lab setup for TIE's RF characterization capabilities.
• Author test reports, standard operating procedures, and design-for-test guidelines to support ecosystem partners and internal engineering teams.

• Define and own the RF test strategy for TIE's 3.0D heterogeneously integrated microsystems across K-band (18-27 GHz), Ka-band (27-40 GHz), and W-band (75-110 GHz), spanning wafer, die, module, and system levels.
• Architect end-to-end test flows-from design-for-testability requirements through production screening-ensuring robust, repeatable, and scalable characterization of RF, mixed-signal, and antenna-in-package subsystems.
• Lead development of advanced de-embedding, calibration, and measurement methodologies for novel 3DHI interconnect structures, including hybrid bonding interfaces, glass/Si interposers, and redistribution layers.
• Drive test-to-model correlation across EM simulation (HFSS, ADS, AWR, CST) and measured data, establishing feedback loops with design, process, and packaging teams to accelerate yield learning and performance optimization.
• Specify, procure, and commission RF test infrastructure-including probe stations, VNA configurations, automated handlers, and environmental chambers-for TIE's characterization lab buildout.
• Establish and mentor the RF test engineering team, setting technical standards, review processes, and best practices for measurement automation, data management, and statistical analysis.
• Engage with foundry, EDA, metrology, and defense-program partners to define and validate test enablement requirements for next-generation RF packaging technologies.
• Author test strategies, reliability qualification plans, reference test procedures, and design-for-test guidelines that become part of TIE's Assembly Design Kit (ADK) deliverables.

• M.S. in Electrical Engineering, Microwave Engineering, Applied Physics, or a related discipline with emphasis on RF/microwave measurement and characterization.
• 5+ years of hands-on experience in RF/microwave testing, characterization, or validation of ICs, modules, or packaged systems operating at K-band frequencies and above.
• Deep working knowledge of S-parameter measurement, VNA calibration techniques, de-embedding, and on-wafer probing methodologies.
• Proficiency with RF test instruments (VNAs, spectrum analyzers, signal generators, power meters) and measurement automation using Python, MATLAB, or LabVIEW.
• Familiarity with RF simulation tools such as Keysight ADS, Ansys HFSS, Cadence AWR, or CST Studio for test-to-model correlation.
• Understanding of electromagnetic effects in advanced packaging-signal integrity, coupling, and loss across interposers, redistribution layers, and 3D stacked assemblies.
• Ability to work cross-functionally with design, packaging, EDA, and process teams in a fast-paced R&D environment.
• Location: Austin, Texas

• M.S. in Electrical Engineering, Microwave Engineering, Applied Physics, or a related discipline with emphasis on RF/microwave measurement, calibration science, or test methodology.
• 10+ years of progressively responsible experience in RF/microwave test engineering, characterization, or validation-including at least 3 years in a technical leadership or principal role.
• Expert-level knowledge of S-parameter characterization, advanced VNA calibration (TRL, LRRM, multi-line), de-embedding, and on-wafer probing techniques at millimeter-wave frequencies.
• Proven ability to architect automated RF test frameworks for R&D characterization and production screening using Python, MATLAB, LabVIEW, or equivalent.
• Deep understanding of electromagnetic effects in advanced packaging-signal integrity, coupling, loss, and thermal interactions across interposers, RDLs, and 3D stacked assemblies.
• Strong proficiency with RF simulation tools (Keysight ADS, Ansys HFSS, Cadence AWR, CST Studio) for rigorous test-to-model correlation and root-cause analysis.
• Track record of building or scaling RF test organizations, including lab infrastructure planning, team development, and process definition.
• Ability to influence cross-functional roadmaps and partner with design, packaging, EDA, and program management teams in a defense-adjacent R&D setting.
• Location. Austin, Texas

Relevant education and experience may be substituted as appropriate.

• Ph.D. in Electrical Engineering, Microwave Engineering, Applied Physics, or a related discipline with emphasis on RF/microwave measurement and characterization.
• Experience testing Antenna-in-Package (AiP), RFIC/SiP, or 3D-stacked RF front-end modules for communications or sensing applications.
• Hands-on experience with wafer-level probing at cryogenic temperatures or under thermal-vacuum conditions for high-frequency systems.
• Familiarity with 3DHI design flows and the associated test challenges across heterogeneous die-to-die and die-to-interposer interfaces.
• Knowledge of GaAs, GaN, SiGe, or CMOS RF processes and their impact on test strategy and fixture design.
• Experience developing automated test frameworks for production screening or reliability qualification of RF components.
• Strong technical writing and presentation skills for defense-sector reporting and industry collaboration.

• Ph.D in Electrical Engineering, Microwave Engineering, Applied Physics, or a related discipline with emphasis on RF/microwave measurement, calibration science, or test methodology.
• Experience defining RF test strategies for Antenna-in-Package (AiP), RFIC/SiP, or 3D-stacked RF front-end modules in volume or pre-production environments.
• Hands-on experience with cryogenic testing, thermal-vacuum characterization, or reliability stress testing of high-frequency systems.
• Familiarity with 3DHI design and assembly flows and the unique test challenges of heterogeneous die-to-die and die-to-interposer interfaces.
• Knowledge of GaAs, GaN, SiGe, and CMOS RF processes and their implications for test planning, fixture design, and yield analysis.
• Publication or patent record in millimeter-wave measurement techniques, calibration methods, RF packaging test, or antenna characterization.
• Experience contributing to design kit or PDK test enablement deliverables.
• Strong technical writing and presentation skills for defense-sector reporting and industry collaboration.

TIE pays industry-competitive salaries.

• May work around standard office conditions
• Repetitive use of a keyboard at a workstation
• Use of manual dexterity (ex: using a mouse)

• Monday - Friday: 8am - 5pm.

• Resume/CV
• 3 work references with their contact information; at least one reference should be from a supervisor

Importantfor applicants who are NOT current university employees or contingent workers:You will be prompted tosubmityour resume the first time you apply, then you will beprovidedan option to upload a new Resume forsubsequentapplications. AnyadditionalRequired Materials (letter of interest, references, etc.) will be uploaded in the Application Questions section; you will be able to multi-selectadditionalfiles. Beforesubmittingyour online job application, ensure thatALLRequired Materials have been uploaded. Once your job application has beensubmitted, you cannot make changes.

Important for Current university employees and contingent workers:As a current university employee or contingent worker, you MUST apply within Workday by searching for Find UT Jobs. If you are a current University employee, log-in to Workday, navigate to your Worker Profile, click the Career link in theleft handnavigation menu and then update the sections in your Professional Profile before you apply. This information will be pulledin toyour application. The application is onepageand you will be prompted to upload your resume. In addition, you must respond to the application questionspresented to upload anyadditionalRequired Materials (letter of interest, references, etc.) that were noted above.

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Employment Eligibility:

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Retirement Plan Eligibility:

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Background Checks:

A criminal history background check will be required for finalist(s) under consideration for this position.

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Equal Opportunity Employer:

The University of Texas at Austin, as an equal opportunity/affirmative action employer,complies with all applicable federal and state laws regarding nondiscrimination and affirmative action. The University is committed to a policy of equal opportunity for all persons and does not discriminate on the basis of race, color, national origin, age, marital status, sex, sexual orientation, gender identity, gender expression, disability, religion, or veteran status in employment, educational programs and activities, and admissions.

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Pay Transparency:

The University of Texas at Austin will not discharge or in any other manner discriminate against employees or applicants because they have inquired about, discussed, or disclosed their own pay or the pay of another employee or applicant. However, employees who have access to the compensation information of other employees or applicants as a part of their essential job functions cannot disclose the pay of other employees or applicants to individuals who do not otherwise have access to compensation information, unless the disclosure is (a) in response to a formal complaint or charge, (b) in furtherance of an investigation, proceeding, hearing, or action, including an investigation conducted by the employer, or (c) consistent with the contractor's legal duty to furnish information.

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Employment Eligibility Verification:

If hired, you will be required to complete the federal Employment Eligibility Verification I-9 form. You will be required to present acceptable and original documents to prove your identity and authorization to work in the United States. Documents need to be presented no later than the third day of employment. Failure to do so will result in loss of employment at the university.

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E-Verify:

The University of Texas at Austin use E-Verify to check the work authorization of all new hires effective May 2015. The university's company ID number for purposes of E-Verify is 854197. For more information about E-Verify, please see the following:

• E-Verify Poster (English and Spanish) [PDF]
• Right to Work Poster (English) [PDF]
• Right to Work Poster (Spanish) [PDF]

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Compliance:

Employees may be required to report violations of law under Title IX and the Jeanne Clery Disclosure of Campus Security Policy and Crime Statistics Act (Clery Act). If this position is identified a Campus Security Authority (Clery Act), you will be notified and provided resources for reporting. Responsible employees under Title IX are defined and outlined in HOP-3031.

The Clery Act requires all prospective employees be notified of the availability of the Annual Security and Fire Safety report. You may access the most recent report here or obtain a copy at University Compliance Services, 1616 Guadalupe Street, UTA 2.206, Austin, Texas 78701.