Group 72--Summer Research Program Intern (Fabrication Engineering)

The Fabrication Engineering Group provides rapid fabrication, assembly, integration, and test of advanced hardware prototypes for national security applications. Examples include the precision machining of fiber mounts for airborne high energy laser systems, multi-functional structures using additive processes for ground-based radar systems, custom printed circuit boards (PCBs) for space-borne data processing, and highly integrated mechanical packaging for undersea communication terminals. Core mechanical competencies span precision fabrication, additive manufacturing, and 5-axis machining. The group concentrates on high-complexity parts, quick-turn capabilities and activities that require concurrent engineering with program teams. Core PCB capabilities include design for manufacturability (DFM), automated solder paste dispensers, precise pick-n-place machines, and automated optical inspection systems. Assembly, integration, and test capabilities include integration spaces, clean rooms, vibration testing, thermal testing, and space simulation chambers. The Group focuses on state-of-practice prototyping capabilities, technical excellence, exceptional collaboration and outstanding operation.

The Fabrication Engineering group is seeking to hire an ambitious and talented summer intern to complement their diverse team. The selected individual will work with members of their technical staff with new developments in advanced fabrication methods across multiple disciplines (electronic, mechanical, chemical & digital). They will also work closely with program team integration activities. The proper candidate will be capable of working independently while also being capable of strategic collaboration with teams, both small and large, to over come engineering challenges.

Required Skills

• Completed no less than two academic years of an undergraduate degree in Mechanical, Electrical, Industrial Engineering or similar sciences.
• Active graduate students (MS or PhD candidate) will also be considered.
• Proven ability to work closely with cross functional teams to overcome engineering challenges.
• Mechanically inclined, prior experience with machining or mechanical assembly desired.
• Recognized self-motivator that seeks to continuously learn and challenge themselves.
• An excitement for learning about new processes that enable programs teams to develop prototype systems that demonstrate technology of national importance.

Preferred Skills

• Knowledge of test equipment, and data acquisition technologies.
• Experience with test equipment such as oscilloscopes, signal generators, or power supplies.
• Experience with software and operating systems such as: Microsoft Office Suite, Windows networking, PLC ladder logic, CAD Software, MATLAB.
• Demonstrated effectivecommunication skills, both written and verbal.
• Familiarity with selective laser melting (SLM) additive manufacturing, powder characterization and handling, X-ray diffraction, and basic metallographic preparation and microscopy.

Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance.

MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.

Requisition ID: 41936